ASM太平洋科技有限公司ASM PACIFIC TECHNOLOGY LIMITED
集團(tuán)行政總裁Group Chief Executive Officer
黃梓達(dá)先生Mr. Robin Ng
2021年注定是半導(dǎo)體歷史上極不平凡的一年。新冠疫情疊加上種種其他因素，使全球供應(yīng)鏈從2020年第四季度開始陷入史無前例的緊張狀態(tài)，對(duì)各類芯片的需求強(qiáng)勢(shì)復(fù)蘇。半導(dǎo)體行業(yè)于過往十年經(jīng)歷難得一遇的大發(fā)展，中國的半導(dǎo)體封測(cè)市場(chǎng)表現(xiàn)尤為突出，在產(chǎn)業(yè)鏈占比更進(jìn)一步提升。臨近2021年末，隨著設(shè)備訂單交付情況改善，集團(tuán)客戶的產(chǎn)能使用率逐步恢復(fù)正常，然而上游晶圓廠產(chǎn)能依舊緊張，而中國半導(dǎo)體封測(cè)產(chǎn)業(yè)亦正加快步伐趕上世界的先進(jìn)科技水平。集團(tuán)深信中國半導(dǎo)體行業(yè)未來將會(huì)維持強(qiáng)勁勢(shì)頭！
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展望2022，世界正在快速步入綠色能源和全面智能化的新時(shí)代，以5G網(wǎng)絡(luò)為基礎(chǔ)，汽車行業(yè)不單會(huì)加快未來轉(zhuǎn)型至潔凈能源的進(jìn)程，高度智能化也是必然的發(fā)展趨勢(shì)；日常生活也將進(jìn)一步全面數(shù)碼化。這必將帶動(dòng)第三代半導(dǎo)體（如碳化硅）、各類傳感器、光通信模塊、存儲(chǔ)器、先進(jìn)封裝及異構(gòu)整合流程（Heterogeneous Integration）、高頻高速多層PCB表面貼裝的需求及進(jìn)一步發(fā)展，此正是ASMPT的優(yōu)勢(shì)所在。集團(tuán)必定會(huì)竭盡所能在通信、AI、云端服務(wù)、新能源、物聯(lián)網(wǎng)、車聯(lián)網(wǎng)、自動(dòng)駕駛、AR/VR以及先進(jìn)工業(yè)自動(dòng)化管理等新興領(lǐng)域中作出貢獻(xiàn)。
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The year 2021 is bound to be a very unusual year in semiconductor history. COVID-19, overlaid with various other factors, has caused unprecedented tensions in the global supply chain since the fourth quarter of 2020. It also caused the strong revival of demand for various chips. The semiconductor industry has undergone extraordinary developments in the past 10 years. China's assembly and testing market has performed particularly well, and its share in the industrial chain has further increased. Towards the end of 2021, with the improvement of equipment delivery, the capacity utilization rate of our customers has gradually returned to normal, but the capacity of upstream wafer fabs is still tight, and China's semiconductor assembly and testing industry is rapidly catching up with the world's advanced technology. We believe that China's semiconductor industry will remain its robust momentum in the coming ?years!
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Looking forward to 2022, the world is rapidly entering a new era of green energy and comprehensive intelligence. Riding on 5G networks, the automotive industry will not only accelerate the future transformation to clean energy, but also a high degree of intelligence is an inevitable development trend. Daily life will also be further digitized. This will inevitably drive the further development and demand for third-generation semiconductors (such as silicon carbide), various sensors, optical communication modules, memory modules, advanced packaging and heterogeneous integration processes for high performance computing, and high-frequency and high-speed multi-layer PCB surface mounting! This is also the advantage of ASMPT! We will make every effort to contribute to the semiconductor industry in emerging fields such as communications, AI, cloud services, new energy, Internet of Things, Internet of Vehicles, autonomous driving, AR / VR and advanced industrial automation management!
